| Product
Specifications |
20-layer
Backplane PCB for Telecom |
|
| Product Model Number |
002 |
| Product
Name |
20-layer
PCB |
| Country
of Origin |
PEOPLE
REPUBLIC OF CHINA |
| Product
Short Description |
20-layer
Backplane PCB |
| Selling
Point |
Fine-line high density
quick turn prototype and small volume pcb
|
| Primary
Competitive Advantages |
Short
leading time, Prototype
and Small Quantity, multilayer |
| Key
Product Specifications / Features |
| 1 |
Quick-turn
prototype and small-quantity PCBs
|
| 2 |
35um
(thickness) copper |
| 3 |
Base
lamination: FR4 |
| 4 |
Board
thickness: 5.5mm (0.216 inch)
|
| 5 |
Board
size: 650.00 x 300.00mm (25.60 x 11.81 inch)
|
| 6 |
PCB
layers: 20-layer board |
| 7 |
Min
Conductor width: 0.20 mm (8 mil)
|
| 8 |
Min
Conductor spacing: 0.20 mm (8 mil) |
| 9 |
Min
Size of plated through holes: 0.65 mm (26 mil)
|
| 10 |
Min
Pad diameter: 1.30 mm (52 mil)
|
| 11 |
Aspect
Ratio: 8.57:1 |
| 12 |
The
Surface treatment type: Immersion Gold
|
| 13 |
CAD:
Gerber file (RS274-X) |
| 14 |
Impedance
control value: 50OHM +/-10% |
| Value
of Minimum Order |
1-9pcs
|
| Payment
Terms |
T/T net
30days |
| Delivery
Lead Time |
15 working
days |
| FOB
Port |
SHENZHEN
|
| FOB
Price Range |
|
| Safety
/ Quality Approvals |
UL E204460 / DNV
ISO 9001 01527-99-AQ-LDN-UKAS
|
