| Product
Specifications |
8-layer
immersion gold plating PCB |
|
|
Product Model Number |
003 |
|
Product
Name |
Multilayer
PCB |
|
Country
of Origin |
PEOPLE
REPUBLIC OF CHINA |
|
Product
Short Description |
8-layer
immersion gold plating PCB |
|
Selling
Point |
Fine-line high density
quick turn prototype and small volume pcb
|
|
Primary
Competitive Advantages |
Short
leading time, Prototype
and Small Quantity, multilayer |
| Key
Product Specifications / Features |
|
1 |
Quick-turn
prototype and small-quantity PCBs
|
|
2 |
35um (thickness)
copper |
|
3 |
Base lamination:
FR4 |
|
4 |
Board thickness:
1.8mm (0.071 inch)
|
|
5 |
Board size:
170.00 x 110.00 mm ( 6.69 x 4.33 inch)
|
|
6 |
PCB layers:
8-layer board |
|
7 |
Min Conductor
width: 0.13 mm (5 mil)
|
|
8 |
Min Conductor
spacing: 0.13 mm (5 mil)
|
|
9 |
Min Size
of plated through holes: 0.25 mm (10 mil)
|
|
10 |
Min Pad
diameter: 0.50 mm (20 mil)
|
|
11 |
The Surface
treatment type: Immersion Gold
|
|
12 |
Min Ni
thickness: >5um, Min Au thickness: >0.05um
|
|
13 |
CAD:
Gerber file (RS274-X) |
|
Value
of Minimum Order |
1-9pcs
|
|
Payment
Terms |
T/T net
30days |
|
Delivery
Lead Time |
5 working
days |
|
FOB
Port |
SHENZHEN
|
|
FOB
Price Range |
|
|
Safety
/ Quality Approvals |
UL E204460 / DNV
ISO 9001 01527-99-AQ-LDN-UKAS
|
