| Product
Specifications |
20-layer
Backplane PCB for Telecom |
|
| Product Model Number |
007 |
| Product
Name |
Multilayer
PCB |
| Country
of Origin |
PEOPLE
REPUBLIC OF CHINA |
| Product
Short Description |
High Frequency
PCB |
| Selling
Point |
Fine-line high density
quick turn prototype and small volume pcb
|
| Primary
Competitive Advantages |
Short
leading time, Prototype
and Small Quantity, multilayer |
| Key
Product Specifications / Features |
1 |
Quick-turn
prototype and small-quantity PCBs
|
2 |
35um (thickness)
copper |
3 |
Base lamination:
Teflon |
4 |
Board thickness:
0.8 mm (0.031 inch)
|
5 |
Board size:
114.30 x 190.50mm (4.5 x 7.5 inch)
|
6 |
PCB layers:
2-layer board |
7 |
Min Conductor
width: 0.3 mm (12 mil)
|
8 |
Min Conductor
spacing: 0.3 mm (12 mil)
|
9 |
Min Size
of plated through holes: 0.4 mm (16 mil)
|
10 |
Min Pad
diameter: 0.6mm (24 mil)
|
11 |
Working
frequency: 1-2G HZ |
12 |
The Surface
treatment type: Flash gold
|
13 |
CAD: Gerber
file (RS274-X) |
14 |
Impedance
control value: 50OHM +/-10% |
| Value
of Minimum Order |
1-9pcs
|
| Payment
Terms |
T/T net
30days |
| Delivery
Lead Time |
5 working
days |
| FOB
Port |
SHENZHEN
|
| FOB
Price Range |
|
| Safety
/ Quality Approvals |
UL E204460 / DNV
ISO 9001 01527-99-AQ-LDN-UKAS
|
